Product Introduction：
In the general transfer molding packaging process of semiconductor and electronics industry,cleaning of moldingis a very important process
One side, some components of molding compound and releasing agent are oxidated at the high temperature (170 ℃ ~ 180 ℃) role, and attached to the mold surface, and form the residue which is difficult to remove. If not remove in time, not only cause the difficulties of mold release and the defects of package appearance, but also damage the surface of the die cavity.
we provide molding cleaning solution: cleaning rubber sheet
Product Advantage:
It is used to clean mold for molding process in semiconductor industry, in can remove epoxy stains formed during packaging in the cavity or surface of mold.
