Product Introduction：
Number: BST9241
Product description: responsible for the use of electrolytic methods to soften and dissociate the body, and then use the high-pressure water knife to abort.
Product specifications: 25L/pail
Product advantage: the overflow is a process after the molding process in the semiconductor industry and electronics industry. This process is usually extensive
Deflashing is a process following plastic package in semiconductor industry and electronics industry. Generally this process extensively uses flammable solution which needs to be boiled under 100-110℃ high temperature. This will easily lead to the peeling off of the sealed parts and impair the reliability of electronic components. After ceaseless efforts, we have perfected the deflashing solutions of the market. We will offer customers tailored solutions to removing various flashes and resin bleed under 50- 80℃ boiled temperature.
