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Fine Chemicals -- Low temperature to the overflow solution
  • Name:Low temperature to the overflow solution
  • Product Introduction:

     

    • Numbering: BST9246
    • Product Introduction:Mainly used in integrated circuits, discrete devices package flashover process. By removing the lead frame packaging after the excess material (Molding flash) can effectively improve the appearance of the product plating and reduce the plating rework rate, improve product reliability.
    • Product specifications:25KG/barrel
    • Product advantages:
      • 1. Easy to maintain, long life, high flash point, the use of safe and reliable
      • 2. Applicable to all kinds of overflow rubber situation, such as vinyl, transparent plastic, red plastic and so on
      • 3. Applicable to all kinds of environmental protection, not environmentally friendly plastic seal material
      • 4. Applicable to all kinds of packaging
      • 5. COD less, wastewater treatment is simple

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  • Phone:+86 755 83555268   Fax:+86 755 83555238  E-Mail:sales@futurehover.com   Address:Room 2801, Block 5A, Longguangjiuzuan Business Center, Tenglong North Road, Minzhi Street, Longhua District, Shenzhen