-
-
![]()
-
-
Other products -- Lead-free solder ball
-
-
-
-
- Name：Other products
-
Product Introduction：
- IC packaging materials for semiconductor and packaging related industries required for production.
The scope of application：
BGA / CSP / FlipChip
- Product specifications：
- Product advantages：
- Lead-free solder ball
- Zero pollution
- Oxygen
- High precision
- RoHS, REACH, SONY hazardous substances and the requirements of the EU's hazardous substances
